zinc-free 25 um electrolytic VLP copper foil for Flexible Copper Clad Laminate
1) Thickness Range: 25m.
2) Width: 5-1380 mm,
3) Length: 500-5000 M.
VLP-THE-HF ED Copper Foil Characteristics.
1. High temperature resistance.
2. Good folding endurance.
3. High conductivity.
VLP ED copper foil application:
. Used for multilayer circuit boards.
. Flexible Copper Clad Laminate.
Q1. Length per roll?
Q2. Are the package suitable For export ?
Yes , it is suitable for export.
Q3. Can you provide COA?
Yes , we can.
Difference between rolled copper foil and electrolytic copper foil.
Density: rolled copper foil higher density, the surface is relatively smooth, conducive to the production of printed circuit board after the rapid transmission of the signal, so high-frequency high-speed transmission, fine lines printed circuit board also used some calendering copper Foil.
Surface treatment width:rolled copper foil be limited by Surface treatment widest effective width of 520mm.
ED copper foil standard width is 1295mm,max width is 1380mm
Typical properties of VLP ED copper foil(for FPC or inner layer of HDI).