Low Profile Pure Copper Sheet Metal RollFor Multilayer Circuit Boards

Business Type
Manufacturer
Country
China
Category

Product Detail

LP jumbo coil 12um ED electrodeposited copper foil for fpc.



Application of LP copper foil.



For Super fine pattern FPC.

And multilayer circuit boards.





Specification reference.



Standard Width 1290mm,max width 1380(1)mm,May according to the customer reque.

Thickness Range: 0.012~0.070 mm.

ID: 76 mm,152 mm.



Packaing:





Different between CA copper foil and ED copper foil.



1. Process: rolled copper foil (Rolling process),ED copper foil (Electrodeposition process).

2. Strength toughness: rolled copper foil is a flaky crystalline structure, so the strength and toughness is better than electrolytic copper foil, so most of the rolling copper foil used in flexible printed circuit boards.



LP/low profile copper foil of Properties.

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Classification | Unit | Requirement | Test Method |
Foil Designation | / | | 1 | H | M | 1 | IPC-4562A |
Nominal thickness | / | 10um | 12um | 1/2 OZ(18um) | 3/4 OZ(25um) | 1 OZ(35um) | IPC-4562A |
Area Weight | g/ | 984 | 1074 | 1535 | 2288 | 28510 | IPC-TM-650 2.2.12.2 |
Purity | | 99.8 | IPC-TM-650 2.3.15 |
Foil Profile | Shiny side(Ra) | m | 2.5 | 2.5 | 2.5 | 2.5 | 2.5 | IPC-TM-650 2.3.17 |
Matte side(Rz) | um | 4.0 | 4.5 | 5.5 | 6.0 | 8.0 |
Tensile Strength | R.T.(23) | Mpa | 260 | 260 | 280 | 280 | 280 | IPC-TM-650 2.3.18 |
H.T.(180) | Mpa | 180 | 180 | 180 | 180 | 180 |
Elongation | R.T.(23) | | 5 | 6 | 8 | 10 | 12 | IPC-TM-650 2.3.18 |
H.T.(180) | | 5 | 6 | 7 | 8 | 8 |
Peel Strength(FR-4) | N/mm | 0.7 | 0.8 | 1.0 | 1.1 | 1.2 | IPC-TM-650 2.4.8 |
Ibs/in | 4 | 4.6 | 5.7 | 6.3 | 6.9 |
Pinholes&porosity | Number | No | IPC-TM-650 2.1.2 |
Anti-oxidization | R.T.(23) | 180days | / |
H.T.(200) | 60 Minutes | / |
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About our Company

Business Type
Manufacturer
Products
Paper Rolls, Pure Copper Foil

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Shanghai Jima Industrial Co.,Ltd

Mr. Jima Jima

China

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