high temperature resistance 25um high conductivity LP ED copper foil for FPC.
Specification of LP copper foil.
1. Range of Thickness : 25um.
2. Range of Width :1380 mm,factory standard width is 1290mm.
3. coil ID: 76 mm or 152 mm.
LP copper foil Features and Performance.
a. High profile with properties of LP-S-B/R suitable for FCCL.
d. low profile enables to make fine circuit pattern.
c. Low profile,
d. high strength,
Use of LP copper foil.
Flexible Copper Clad Laminate with Casting and lamination type,Super fine pattern FPC,Chip on flex (COF) for LED,multilayer circuit boards.
Difference between rolled copper foil and electrolytic copper foil.
Performance is different ,Strength toughness: rolled copper foil is a flaky crystalline structure, so the strength and toughness is better than electrolytic copper foil, so most of the rolling copper foil used in flexible printed circuit boards.Width different:: rolling copper foil width 620mm, electrolytic copper foil width 1380mm.